Lihlahisoa
Panasonic SMT Chip Mounter NPM-W2
Likaroloana
Tlhahiso e phahameng le boleng bo nang le ts'ebetso ea ho hatisa, ho beha le ho hlahlobaHo ipapisitsoe le PCB eo u e hlahisang, u ka khetha Mokhoa oa lebelo le phahameng kapa mokhoa o nepahetseng haholo.
Bakeng sa mapolanka a maholo le likarolo tse kholoanyaneLi-PCB ho fihlela boholo ba 750 x 550 mm tse nang le likarolo tse fapaneng ho fihlela L150 x W25 x T30 mm
Tlhahiso e phahameng ea sebaka ka ho beoa ha litsela tse peliHo ipapisitse le PCB eo u e hlahisang, u ka khetha mokhoa o nepahetseng oa ho beha - "Ikemetseng" "Alternate" kapa "Hybrid"
Ho lemoha ka nako e le 'ngoe tlhahiso ea sebaka se phahameng le ho behoa ka mokhoa o nepahetseng
Mokhoa o phahameng oa tlhahiso (Mokhoa oa tlhahiso e phahameng: ON)
Max.lebelo: 77 000 cph *1 (IPC9850(1608):59 200cph *1 ) / Ho nepahala ha sebaka: ± 40 μm
Mokhoa o phahameng oa ho nepahala (Mokhoa oa tlhahiso e phahameng: OFF)
Max.lebelo: 70 000 cph * 1 / Ho nepahala ha ho beoa: ± 30 μm (Khetho: ± 25μm *2)
* 1: Tact bakeng sa 16NH × 2 hlooho * 2: Tlas'a maemo a boletsoeng ke PSFS
Hlooho e ncha ea ho beha
 | Hlooho e bobebe ea 16-nozzle |
Setsi se secha se thata haholo
· Motheo o thata o ts'ehetsang ho beoa ka lebelo le holimo / ho nepahala
Khamera e tsebahalang haholo
· Tse tharo tsa ho tsebahatsa mesebetsi li kopantsoe ho khamera e le 'ngoe
· Sekeno sa temoho e potlakileng ho kenyeletsoa le ho lemoha likarolo tsa bophahamo
· E ka ntlafatsoa ho tloha ho 2D ho ea ho litlhaloso tsa 3D
Tlhophiso ea Mochini
Moralo & Front Feeder Layout
 | Likarolo tse fapaneng tse 60 li ka kenngoa ho tsoa ho li-feeders tsa tepi tsa 16mm. |
Sebopeho sa Tray e le 'Ngoe
13 li-feeder slots tse tsitsitseng lia fumaneha.Ho kenya li-tray tsa PoP hoa khoneha ka yuniti ea phetisetso.
Sebopeho sa Twin Tray
Ha terei e le 'ngoe e sebelisetsoa tlhahiso, terei e 'ngoe e ka sebelisoa ka nako e le' ngoe ho hlophisa tlhahiso e latelang esale pele.
Multi-functionality
Boto e Khōlō
Litlhaloso tsa tsela e le 'ngoe (Khetho ea khetho.)
Boto e kholo ho fihla ho 750 x 550 mm e ka sebetsoa
Litlhaloso tsa litsela tse peli (Khetho ea khetho.)
Liboto tse kholo (750 x 260 mm) li ka tšoaroa hammoho.
Likaroloana tse kholo
E lumellana le boholo ba likarolo ho fihla ho 150 x 25 mm
Ho beoa ha LED
Khanya Binning
Qoba ho kopanya khanya le ho fokotsa ho lahloa ha likaroloana le ho thibela.
* Ka kopo, re botse li-nozzles tse tšehetsang likarolo tsa LED tsa libopeho tse fapaneng
Mesebetsi e meng
· Mosebetsi oa ho lemoha matšoao a mabe lefatšeng ka bophara O fokotsa nako ea ho tsamaea/ho tseba ho lemoha matšoao a mabe
· PCB standby lipakeng tsa mechini (e kenyellelitsoe conveyor) E fokotsa nako ea phetoho ea PCB (750 mm)
Tlhahiso e phahameng - E sebelisa mokhoa oa ho kenya habeli
Sebaka se Seng, se Ikemetseng le sa Hybrid
Mokhoa o ikhethileng oa "Alternate" le "Ikemetseng" o u lumella ho sebelisa monyetla o mong le o mong hantle.
Alternate : Lihlooho tse ka pele le tse ka morao li beha li-PCB tse ka pele le tse ka morao ka ho fapanyetsana.
E ikemetseng: Hlooho e ka pele e beha PCB ka pele 'me hlooho e ka morao e beha ka morao.
Phetoho e ikemetseng
Ka mokhoa o ikemetseng, o ka tsamaisa phetoho tseleng e le 'ngoe ha tlhahiso e ntse e tsoela pele ka tsela e' ngoe. U ka fapanyetsana kariki ea phepelo nakong ea tlhahiso hape le yuniti e ikemetseng ea phetoho (khetho).E ts'ehetsa phetoho ea phini ea othomathike (khetho) le phetoho ea othomathiki (khetho) e le hore e fane ka phetoho e ntle ka ho fetisisa bakeng sa mofuta oa tlhahiso ea hau.
Phokotso ea nako ea phapanyetsano ea PCB
Li-PCB tse peli li ka thijoa sethaleng se le seng (bolelele ba PCB : 350 mm kapa ka tlase) .Le tlhahiso e Phahameng e ka lemohuoa ka ho fokotsa nako ea phapanyetsano ea PCB.
Phetoho e iketsang ea liphini tsa tšehetso (khetho)
Fetola boemo ba lithapo tsa tšehetso ho etsa hore phetoho e sa khaotse le ho thusa ho boloka liphoso tsa matla le ts'ebetso.
Ntlafatso ea boleng
Ts'ebetso ea taolo ea bophahamo ba sebaka
Ho ipapisitsoe le data ea boemo ba PCB le botenya ba karolo e 'ngoe le e 'ngoe e lokelang ho beoa, taolo ea bophahamo ba sebaka e ntlafalitsoe ho ntlafatsa boleng ba ho hola.
Ntlafatso ea sekhahla sa ts'ebetso
Feeder sebaka mahala
Ka har'a tafole e tšoanang, li-feeders li ka hlophisoa kae kapa kae.Kabo e 'ngoe hammoho le ho beha li-feeders tse ncha bakeng sa tlhahiso e latelang li ka etsoa ha mochine o ntse o sebetsa.
Bafepi ba tla hloka tlhahiso ea data ntle le marang-rang ka seteishene sa tšehetso (khetho).
Tlhahlobo ea Solder (SPI) ・ Tlhahlobo ea Karolo (AOI) - Hlooho ea tlhahlobo
Tlhahlobo ea Solder
· Tlhahlobo ea ponahalo ea solder
Mounted component Inspection
· Tlhahlobo ea ponahalo ea likarolo tse behiloeng
Tekolo ea ntho e tsoang kantle e hlongoang esale pele*1 tlhahlobo
· Ho hlahlojoa ha lintho tsa kantle ho naha pele ho li-BGAs
· Tlhahlobo ea ntho ea kantle ho naha hang pele ho beoa nyeoe e tiisitsoeng
* 1: Ntho ea kantle ho naha e fumaneha ho likarolo tsa chip.
SPI le AOI ho fetoha ha othomathike
· Tlhahlobo ea solder le karolo e fetoloa ka bo eona ho latela data ea tlhahiso.
Ho kopanya lintlha tsa tlhahlobo le ho beoa
· Laeborari ea karolo e laoloang ke Bohareng kapa ho hokahanya data ha e hloke tlhokomelo ea lintlha tse peli tsa ts'ebetso ka 'ngoe.
Sehokelo sa othomathike sa litaba tsa boleng
· Tlhahisoleseding ea boleng e hokahaneng ka boiketsetso ea ts'ebetso e 'ngoe le e' ngoe e thusa tlhahlobo ea sesosa sa bothata.
Adhesive Dispensing - Ho fana ka hlooho
Mokhoa oa ho lahla oa mofuta oa screw
· Panasonic's NPM e na le mochini o tloaelehileng oa ho ntša HDF, o netefatsang phepelo ea boleng bo holimo.
E ts'ehetsa mekhoa e fapaneng ea ho fana ka matheba / setšoantšo
· Sensor e nepahetseng e phahameng (khetho) e lekanya bolelele ba PCB ea lehae ho lekanya bophahamo ba phano, e lumellang phepelo e sa amaneng le batho ho PCB.
Sekgomaretsi sa ho Ikamahanya
Letoto la rona la ADE 400D ke sekhomaretsi sa SMD se folisang mocheso o phahameng se nang le phello e ntle ea ho iketsetsa karolo.Sekhomaretsi sena se boetse se loketse ho sebelisoa meleng ea SMT ho lokisa likarolo tse kholoanyane.
Ka mor'a hore solder e qhibilihe, ho itlhophisa le ho teba ha karolo ho etsahala.
Ho beoa ha boleng bo holimo - sistimi ea APC
E laola ho fapana ha li-PCB le likarolo, joalo-joalo motheong oa ho fihlela tlhahiso ea boleng.
APC-FB*1 Maikutlo ho mochini oa khatiso
· Ho ipapisitsoe le data e hlahlobiloeng ea litekanyo ho tsoa litlhahlobong tsa solder, e lokisa maemo a khatiso.(X,Y,θ)
APC-FF*1 Phepelo ho mochini o behang
· E sekaseka lintlha tsa tekanyo ea boemo ba solder, le ho lokisa maemo a ho beoa ha likarolo (X, Y, θ) ho latela.Chip components (0402C/R ~)Package component (QFP, BGA, CSP)
APC-MFB2 Feedforward ho AOI /Feedback ho mochini o behang
· Tlhahlobo ea boemo boemong ba APC offset
· Sistimi e sekaseka lintlha tsa tekanyo ea boemo ba karolo ea AOI, e lokisa boemo ba sebaka (X, Y, θ) , 'me ka hona e boloka ho nepahala ha sebaka.E lumellana le likaroloana tsa chip, likaroloana tse tlase tsa elektrode le likarolo tsa loto*2
* 1 : APC-FB (feedback) /FF (feedforward) : Mochini oa tlhahlobo oa 3D oa k'hamphani e 'ngoe o ka boela oa kopanngoa.(Ka kopo, botsa morekisi oa lehae bakeng sa lintlha.)*2 : APC-MFB2 (mounter feedback2) : Mefuta e sebetsang ea likarolo e fapana ho tloha ho morekisi oa AOI ho ea ho o mong.(Ka kopo, botsa moemeli oa hau oa thekiso ea lehae bakeng sa lintlha.)
Khetho ea Netefatso ea Karolo - Seteishene sa tšehetso sa ho seta kantle ho marang-rang
E thibela liphoso tsa ho seta nakong ea phetoho E fana ka keketseho ea katleho ea tlhahiso ka ts'ebetso e bonolo
* Li-scanner tse se nang mohala le lisebelisoa tse ling tse lokelang ho fanoa ke moreki
· E thibela ho se be teng ha karolo ka boomo E thibela ho se behoe hantle ka ho netefatsa lintlha tsa tlhahiso ka lintlha tsa barcode mabapi le likarolo tsa phetoho.
· Automatic setup data synching functionMochini ka boeona o etsa netefatso, o tlosa tlhoko ea ho khetha data ea ho seta e arohaneng.
· Interlock tshebetsoMathata leha e le efe kapa ho hloleha ho netefatsa ho tla emisa mochini.
· Mosebetsi oa navigationTsebetso ea ho tsamaea ho etsa hore ts'ebetso ea netefatso e utloisisehe habonolo.
Ka liteishene tsa ts'ehetso, ho ka khoneha ho lokisa likariki tse fepelang kantle ho marang-rang esita le ka ntle ho sebaka sa tlhahiso.
• Mefuta e 'meli ea liteishene tsa tšehetso lia fumaneha.
Bokhoni ba ho fetola - Khetho ea phetoho e iketsang
Ho tšehetsa phetoho (data ea tlhahiso le phetoho ea bophara ba terene) e ka fokotsa tahlehelo ea nako
• PCB ID bala-in typePCB ID mosebetsi oa ho bala o ka khethoa har'a mefuta e 3 ea kantle ea sekena, khamera ea hlooho kapa foromo ea moralo.
Bokhoni ba ho fetola - Khetho ea ho seta sa phepelo ea phepelo
Ke sesebelisoa sa ts'ehetso ho tsamaisa mokhoa o sebetsang oa ho seta.Lisebelisoa tsa lisebelisoa ka nako e lekaneng ea ho etsa le ho qeta ts'ebetso ea ho seta ha ho hakanngoa nako e hlokahalang bakeng sa tlhahiso le ho fa opareitara litaelo tsa ho seta.Sena se tla bona le ho tsamaisa ts'ebetso ea ho seta nakong ea ho seta mohala oa tlhahiso.
Ntlafatso ea sekhahla sa ts'ebetso - Likarolo tse fanang ka khetho ea navigator
Sesebelisoa sa ts'ehetso ea phepelo ea karolo se tsamaisang lintho tse tlang pele ka nepo tsa phepelo ea likarolo.E nka nako e setseng ho fihlela karolo e fela le tsela e nepahetseng ea motsamao oa opareitara ho romela litaelo tsa phepelo ea likarolo ho opareitara ka 'ngoe.Sena se fihlella phepelo ea likarolo tse sebetsang hantle.
*PanaCIM e hlokeha ho ba le basebetsi ba ikarabellang bakeng sa ho fana ka lisebelisoa ho mela e mengata ea tlhahiso.
Ts'ebetso ea puisano ea tlhahisoleseling ea PCB
Tlhahisoleseding ea kananelo ea matšoao e entsoeng mochining oa pele oa NPM moleng o fetisetsoa mecheng ea NPM e tlase. E ka fokotsang nako ea potoloho ka ho sebelisa tlhaiso-leseling e fetisitsoeng.
Sistimi ea Tlhahiso ea Lintlha - NPM-DGS (Moetso oa No.NM-EJS9A)
Sephutheloana sa software se thusa ho fihlela tlhahiso e phahameng ka taolo e felletseng ea popo, ho hlophisa le ho etsisa lintlha tsa tlhahiso le laeborari.
*1:Komporo e tlameha ho rekoa ka thoko.*2: NPM-DGS e na le mesebetsi e 'meli ea tsamaiso ea mokato le mola.
Multi-CAD import
Hoo e ka bang data eohle ea CAD e ka fumanoa ka ho ngolisoa ha litlhaloso tse kholo.Thepa, joalo ka polarity, le eona e ka netefatsoa skrineng esale pele.
Ketsiso
Ketsiso e bohlale e ka netefatsoa skrineng esale pele e le hore kakaretso ea ts'ebetso ea mohala e ka eketseha.
Mohlophisi oa PPD
Ka ho bokella kapele le ha bonolo data ea hlooho ea ho beha le ho hlahloba skrineng ea PC nakong ea ts'ebetso, tahlehelo ea nako e ka fokotsoa.
Laebrari ea likarolo
Laeborari ea karolo ea mechini eohle e behang ho kenyeletsoa letoto la CM fatše e ka ngolisoa ho kopanya taolo ea data.
Kopanya Setter ea Mosebetsi (MJS)
Ntlafatso ea data ea tlhahiso e lumella NPM-D2 ho hlophisa li-feeders hangata. Phokotso ea nako ea phepelo bakeng sa phetoho e ka ntlafatsa tlhahiso.
Tlhahiso ea likarolo tsa kantle ho marang-rangkgetho
Ka ho theha lintlha tsa likarolo tse kantle ho marang-rang u sebelisa sehatisi se rekiloeng lebenkeleng, tlhahiso le boleng li ka ntlafatsoa.
Sistimi ea Tlhahiso ea data - Yuniti ea Khamera e kantle ho Marang-rang (khetho)
E fokotsa nako mochining bakeng sa mananeo a laeborari ea likarolo mme e thusa ho fumaneha ha lisebelisoa le boleng.
Lintlha tsa pokello ea likarolo li hlahisoa ho sebelisoa khamera ea mohala
Ntlafatso ea boleng - Sebali sa tlhaiso-leseling ea boleng
Ena ke software e etselitsoeng ho ts'ehetsa kutloisiso ea lintlha tse fetohang le tlhahlobo ea lintlha tse nang le bofokoli ka ho bonts'a tlhaiso-leseling e amanang le boleng (mohlala, maemo a phepelo a sebelisitsoeng, boleng ba tlhokomeliso le lintlha tsa likarolo) ho PCB ka 'ngoe kapa sebaka sa ho beoa.Tabeng ea hlooho ea rona ea tlhahlobo e hlahisoang, libaka tse nang le bokooa li ka bontšoa ka ho kopana le boitsebiso bo amanang le boleng
* PC ea hlokahala bakeng sa mohala o mong le o mong.
Fesetere ea pono ea litaba tsa boleng bo holimo
Mohlala oa ts'ebeliso ea sebali sa tlhaiso-leseling ea boleng
E hloaea sesebelisoa se sebelisetsoang ho kenya liboto tse nang le bokooa.'Me haeba, ho etsa mohlala, u na le mesalignments tse ngata ka mor'a ho splicing, mabaka a sekoli a ka nkoa e le ka lebaka la;
1.splicing liphoso (ho kheloha ha molumo ho senoloa ke ho lemoha boleng ba offset)
2.ho fetoha ha sebopeho sa motsoako (lotho e fosahetseng ea reel kapa barekisi)
Kahoo u ka nka khato e potlakileng ho khalemelo e fosahetseng.
Tlhaloso
| ID ea mohlala | NPM-W2 | |||||
| Hlooho e ka morao Hlooho e ka pele | Hlooho e bobebe ea 16-nozzle | 12-nozzle hlooho | Hlooho e bobebe ea 8-nozzle | 3-nozzle hlooho V2 | Hlooho e abelang | Ha ho hlooho |
| Hlooho e bobebe ea 16-nozzle | NM-EJM7D | NM-EJM7D-MD | NM-EJM7D | |||
| 12-nozzle hlooho | NM-EJM7D-MD | |||||
| Hlooho e bobebe ea 8-nozzle | ||||||
| 3-nozzle hlooho V2 | ||||||
| Hlooho e abelang | NM-EJM7D-MD | NM-EJM7D-D | ||||
| Hlooho ea ho hlahloba | NM-EJM7D-MA | NM-EJM7D-A | ||||
| Ha ho hlooho | NM-EJM7D | NM-EJM7D-D | ||||
| PCB litekanyo(mm) | Tsela e le 'ngoe*1 | Ho kenya batch | L 50 x W 50 ~ L 750 x W 550 |
| Ho kenya 2-positin | L 50 x W 50 ~ L 350 x W 550 | ||
| Litsela tse peli *1 | Phetiso e habeli (Batch) | L 50 × W 50 ~ L 750 × W 260 | |
| Phetiso e habeli (2-positin) | L 50 × W 50 ~ L 350 × W 260 | ||
| Phetiso e le 'ngoe (Batch) | L 50 × W 50 ~ L 750 × W 510 | ||
| Phetisetso e le 'ngoe (2-positin) | L 50 × W 50 ~ L 350 × W 510 | ||
| Mohloli oa motlakase | 3-mohato AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
| Mohloli oa moea *2 | 0.5 MPa, 200 L /m (ANR) | ||
| Boholo *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
| Mmisa | 2 470 kg (Ke bakeng sa 'mele oa mantlha feela : Sena se fapana ho latela khetho ea khetho.) | ||
| Hlooho ya ho beha | Hlooho e bobebe ea 16-nozzle (Hlooho ka 'ngoe) | 12-nozzle hlooho (hlooho ka 'ngoe) | Hlooho e bobebe ea 8-nozzle (Hlooho ka 'ngoe) | 3-nozzle hlooho V2 (Hlooho ka 'ngoe) | |||
| Mokhoa o phahameng oa tlhahiso[ON] | Mokhoa o phahameng oa tlhahiso[OFF] | Mokhoa o phahameng oa tlhahiso[ON] | Mokhoa o phahameng oa tlhahiso[OFF] | ||||
| Max.peed | 38 500cph(0.094 s/ chip) | 35 000cph(0.103 s/ chip) | 32 250cph(0.112 s/ chip) | 31 250cph(0.115 s/ chip) | 20 800cph(0.173 s/ chip) | 8 320cph(0.433 s/ chip)6 500cph(0.554 s/ QFP) | |
| Ho nepahala ha sebaka(Cpk □1) | ± 40 μm / chip | ± 30 μm / chip (±25μm / chip)*6 | ± 40 μm / chip | ± 30 μm / chip | ± 30 µm/chip± 30 µm/QFP □ 12mm ho □ 32mm± 50 µm/QFP □ 12mm Tlas’a | ± 30 µm/QFP | |
| Likarolo tsa likarolo (mm) | 0402*7 chip ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 | 0402 * 7 chip ~ L 12 x W 12 x T 6,5 | 0402*7 chip ~ L 32 x W 32 x T 12 | 0603 chip ho L 150 x W 25 (diagonal152) x T 30 | ||
| Phepelo ea karolo | Ho tlanya | Theipi: 4/8/12/16/24/32/44/56 mm | Tape: 4 ho 56 mm | tšoene: 4 ho 56 / 72 / 88 / 104 limilimithara | |||
| Max.120 (Theipi: 4, 8 mm) | Litlhaloso tsa kariki ea ho fepa ka pele/ka morao : Max.120( Bophara ba theipi le sefepi li ipapisitse le maemo a ka ho le letšehali) Litlhaloso tsa terei e le 'ngoe : Max.86( Bophara ba theipi le sefepi li ipapisitse le maemo a ka ho le letšehali) Litlhaloso tsa literei tse peli : Max. .60( Bophara ba theipi le sefepi li ipapisitse le maemo a ka ho le letšehali) | ||||||
| Thupa | Litlhaloso tsa kariki ea ho fepa ka pele/ka morao :Max.30 (Sefepi sa thupa e le 'ngoe)Litlhaloso tsa terei e le 'ngoe :Max.21 (Sefepi se le seng sa thupa e le 'ngoe) Litlhaloso tsa terei e 'ngoe :Max.15 (Sefepi se le seng sa thupa e le 'ngoe) | ||||||
| Terei | Litlhaloso tsa terei e le 'ngoe : Max.20Twin lintlha tsa tray : Max.40 | ||||||
| Hlooho e abelang | Ho fana ka matheba | Tlisa kabo |
| Lebelo la ho aba | 0.16 s/dot (Boemo: XY=10 mm, Z=ka tlase ho 4 mm motsamao, Ha ho θ ho potoloha | 4.25 s/karolo (Boemo : 30 mm x 30 mm hukung ya phepelo)*9 |
| Ho nepahala ha boemo ba sekhomaretsi (Cpk □1) | ± 75 μ m / letheba | ± 100 μ m /karolo |
| Likarolo tse sebetsang | 1608 chip ho SOP,PLCC,QFP, Connector, BGA, CSP | BGA, CSP |
| Hlooho ea ho hlahloba | Hlooho ea tlhahlobo ea 2D (A) | Hlooho ea tlhahlobo ea 2D (B) | |
| Qeto | 18µm | 9µm | |
| Sheba boholo (mm) | 44.4 x 37.2 | 21.1 x 17.6 | |
| Nako ea ts'ebetso ea tlhahlobo | Tlhahlobo ea Solder *10 | 0.35s/ Boholo ba pono | |
| Tlhahlobo ea Karolo *10 | 0.5s/ Boholo ba pono | ||
| Ntho ea ho hlahloba | Tlhahlobo ea Solder *10 | Karolo ea chip: 100 μm × 150 μm kapa ho feta (0603 kapa ho feta)Karolo ea sephuthelo: φ150 μm kapa ho feta | Karolo ea chip: 80 μm × 120 μm kapa ho feta (0402 kapa ho feta)Karolo ea sephutheloana: φ120 μm kapa ho feta |
| Tlhahlobo ea Karolo *10 | Square chip (0603 kapa ho feta), SOP, QFP (sekontiri sa 0.4mm kapa ho feta), CSP, BGA, Aluminium electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 | Square chip (0402 kapa ho feta), SOP, QFP (sekontiri sa 0.3mm kapa ho feta), CSP, BGA,Aluminium electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 | |
| Lintho tsa tlhahlobo | Tlhahlobo ea Solder *10 | Ho thothomela, ho fifala, ho se tsamaisane hantle, sebopeho se sa tloaelehang, borokho | |
| Tlhahlobo ea Karolo *10 | Ho haella, ho sisinyeha, ho phaphamala, polarity, tlhahlobo ea ntho e tsoang kantle ho naha *12 | ||
| Ho nepahala ha boemo ba tlhahlobo *13( Cpk □1) | ± 20 μm | ± 10 μm | |
| Che ea tlhahlobo | Tlhahlobo ea Solder *10 | Max.30 000 pcs./machine (No. ea likarolo : Max. 10 000 pcs./machine) | |
| Tlhahlobo ea Karolo *10 | Max.10 000 li-pcs./mochini | ||
| *1 | : | Ka kopo ikopanye le rona ka thoko ha o ka e hokela ho NPM-D3/D2/D.Ha e khone ho hokela ho NPM-TT le NPM. |
| *2 | : | Feela bakeng sa 'mele o moholo |
| *3 | : | 1 880 mm ka bophara haeba li-conveyors tse atolositsoeng (300 mm) li behiloe ka mahlakoreng ka bobeli. |
| *4 | : | Bophahamo ba D ho kenyeletsoa le sefepi sa terei : 2 570 mmDimension D ho kenyelletswa le kariki e fepang: 2 465 mm |
| *5 | : | Ho sa kenyelelitsoe sebono, tora ea mats'oao le sekoaelo sa fan sa siling. |
| *6 | : | ±25 μm khetho ea ho beha sebaka.(Tlas'a maemo a boletsoeng ke PSFS) |
| *7 | : | Chip ea 03015/0402 e hloka nozzle/feeder e itseng. |
| *8 | : | Ts'ehetso ea ho beha chip ea 03015 mm ke boikhethelo.(Tlas'a maemo a boletsoeng ke PSFS: Ho nepahala ha sebaka ± 30 μm / chip) |
| *9 | : | Nako ea tekanyo ea bolelele ba PCB ea 0.5s e kenyelelitsoe. |
| *10 | : | Hlooho e le 'ngoe e ke ke ea sebetsana le tlhahlobo ea solder le tlhahlobo ea likarolo ka nako e le' ngoe. |
| *11 | : | Ka kopo sheba bukana ea litlhaloso bakeng sa lintlha. |
| *12 | : | Ntho e tsoang kantle ho naha e fumaneha ho likarolo tsa chip.(ntle le 03015 mm chip) |
| *13 | : | Ena ke boemo bo nepahetseng ba tlhahlobo ea solder e lekantsoeng ke referense ea rona re sebelisa khalase ea PCB bakeng sa ho lekanya sefofane.E ka 'na ea angoa ke phetoho ea tšohanyetso ea mocheso o potolohileng. |
* Nako ea masene ea ho beha, nako ea tlhahlobo le boleng ba ho nepahala li ka fapana hanyane ho latela maemo.
* Ka kopo sheba bukana ea litlhaloso bakeng sa lintlha.
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