Lihlahisoa
Panasonic SMT Chip Mounter NPM-D3
Sebopeho
Tlhahiso e phahameng ea sebaka se nang le methalo eohle ea ho hlongoa Tlhahiso e phahameng le boleng bo nang le ts'ebetso ea khatiso, ho beoa le tlhahlobo.
Li-module tse ka hlophisoang li lumella ho tenyetseha ha line setupHead sebaka ka mesebetsi ea plug-and-play.
Taolo e felletseng ea mela, fatše le feme e nang le sistimi ea softwareProduction plan support through line operation monitoring.
Total Line tharollo
Mela e menyenyane-e nyane ea modular ka ho kenya lihlooho tsa tlhahlobo
E fana ka tlhahiso ea boleng bo holimo e nang le tlhahlobo ea in-line
*1:PCB traverser conveyor e tla lokisoa ke moreki.*2:Ka kopo ikopanye le moemeli oa hau oa thekiso bakeng sa lihatisi tse sebetsang le lintlha tse ling.
Multi-Production Line
Tlhahiso e tsoakiloeng e nang le li-substrates tsa mefuta e fapaneng moleng o le mong le eona e fanoa ka conveyor e habeli.
Ho lemoha ka nako e le 'ngoe tlhahiso ea sebaka se phahameng le ho behoa ka mokhoa o nepahetseng
Mokhoa o phahameng oa tlhahiso (Mokhoa oa tlhahiso e phahameng: ON
Max.lebelo: 84 000 cph *1 (IPC9850 (1608): 63 300cph *1 )/ Ho nepahala ha sebaka: ± 40 μm
Mokhoa o phahameng oa ho nepahala (Mokhoa oa tlhahiso e phahameng: OFF
Max.lebelo: 76 000 cph *1 / Ho nepahala ha ho beoa: ± 30 μm (Khetho: ± 25μm *2)
* 1: Tact bakeng sa 16NH × 2 hlooho * 2: Tlas'a maemo a boletsoeng ke Panasonic
Hlooho e ncha ea ho beha
 | Hlooho e bobebe ea 16-nozzle |
Setsi se secha se thata haholo
 | Motheo o thata o ts'ehetsang ho beoa ka lebelo le holimo / ho nepahala |
Khamera e tsebahalang haholo
· Tse tharo tsa ho tsebahatsa mesebetsi li kopantsoe ho khamera e le 'ngoe
· Sekeno sa temoho e potlakileng ho kenyeletsoa le ho lemoha likarolo tsa bophahamo
· E ka ntlafatsoa ho tloha ho 2D ho ea ho litlhaloso tsa 3D
Tlhahiso e phahameng - E sebelisa mokhoa oa ho kenya habeli
Sebaka se Seng, se Ikemetseng le sa Hybrid
Mokhoa o ikhethileng oa "Alternate" le "Ikemetseng" o u lumella ho sebelisa monyetla o mong le o mong hantle.
• E 'ngoe :
Lihlooho tse ka pele le tse ka morao li beha li-PCB tse ka pele le tse ka morao ka tsela e fapaneng.
• Ho Ikemela :
Hlooho e ka pele e beha PCB ka pele 'me hlooho e ka morao e beha ka morao.
Tlhahiso e phahameng ka ho beoa ho ikemetseng ka botlalo
E finyelletse ho behoa ka mokhoa o ikemetseng oa likarolo tsa li-tray ka ho hokahanya ka ho toba le NPM-TT (TT2) .E khona ho beha ka ho feletseng likarolo tsa li-tray ho ntlafatsa nako ea potoloho ea bohareng, boholo bo boholo ba karolo ea karolo e nang le hlooho ea 3-nozzle.Sephetho sa mohala kaofela sea ntlafatsoa.
Phokotso ea nako ea phapanyetsano ea PCB
Lumella PCB e emeng e nang le tlase ho L=250mm* ho conveyor e holimo ka har'a mochini ho fokotsa nako ea phapanyetsano ea PCB le ho ntlafatsa tlhahiso.
*Ha u khetha li-conveyor tse khutšoane
Phetoho e iketsang ea liphini tsa tšehetso (khetho)
Fetola boemo ba lithapo tsa tšehetso ho etsa hore phetoho e sa khaotse le ho thusa ho boloka liphoso tsa matla le ts'ebetso.
Ntlafatso ea boleng
Ts'ebetso ea taolo ea bophahamo ba sebaka
Ho ipapisitsoe le data ea boemo ba PCB le botenya ba karolo e 'ngoe le e 'ngoe e lokelang ho beoa, taolo ea bophahamo ba sebaka e ntlafalitsoe ho ntlafatsa boleng ba ho hola.
Ntlafatso ea sekhahla sa ts'ebetso
Feeder sebaka mahala
Ka har'a tafole e tšoanang, li-feeders li ka hlophisoa kae kapa kae.Kabo e 'ngoe hammoho le ho beha li-feeders tse ncha bakeng sa tlhahiso e latelang li ka etsoa ha mochine o ntse o sebetsa.
Bafepi ba tla hloka tlhahiso ea data ntle le marang-rang ka seteishene sa tšehetso (khetho).
Tlhahlobo ea Solder (SPI) • Tlhahlobo ea Karolo (AOI) - Hlooho ea tlhahlobo
Tlhahlobo ea Solder
· Tlhahlobo ea ponahalo ea solder
Mounted component Inspection
· Tlhahlobo ea ponahalo ea likarolo tse behiloeng
Tekolo ea ntho e tsoang kantle e hlongoang esale pele*1 tlhahlobo
· Ho hlahlojoa ha lintho tsa kantle ho naha pele ho li-BGAs
· Tlhahlobo ea ntho ea kantle ho naha hang pele ho beoa nyeoe e tiisitsoeng
*1: E reretsoe likarolo tsa chip (ntle le 03015 mm chip).
SPI le AOI ho fetoha ha othomathike
· Tlhahlobo ea solder le karolo e fetoloa ka bo eona ho latela data ea tlhahiso.
Ho kopanya lintlha tsa tlhahlobo le ho beoa
· Laeborari ea karolo e laoloang ke Bohareng kapa ho hokahanya data ha e hloke tlhokomelo ea lintlha tse peli tsa ts'ebetso ka 'ngoe.
Sehokelo sa othomathike sa litaba tsa boleng
· Tlhahisoleseding ea boleng e hokahaneng ka boiketsetso ea ts'ebetso e 'ngoe le e' ngoe e thusa tlhahlobo ea sesosa sa bothata.
Adhesive Dispensing - Ho fana ka hlooho
Mokhoa oa ho lahla oa mofuta oa screw
· Panasonic's NPM e na le mochini o tloaelehileng oa ho ntša HDF, o netefatsang phepelo ea boleng bo holimo.
E ts'ehetsa mekhoa e fapaneng ea ho fana ka matheba / setšoantšo
· Sensor e nepahetseng e phahameng (khetho) e lekanya bolelele ba PCB ea lehae ho lekanya bophahamo ba phano, e lumellang phepelo e sa amaneng le batho ho PCB.
Ho beoa ha boleng bo holimo - sistimi ea APC
E laola ho fapana ha li-PCB le likarolo, joalo-joalo motheong oa ho fihlela tlhahiso ea boleng.
APC-FB*1 Maikutlo ho mochini oa khatiso
● E ipapisitse le lintlha tse hlahlobiloeng tsa litekanyo tse tsoang litlhahlobong tsa solder, e lokisa maemo a khatiso.(X,Y,θ)
APC-FF*1 Phepelo ho mochini o behang
· E sekaseka lintlha tsa tekanyo ea boemo ba solder, le ho lokisa maemo a ho beoa ha likarolo (X, Y, θ) ho latela.Chip components (0402C/R ~)Package component (QFP, BGA, CSP)
APC-MFB2 Feedforward ho AOI /Feedback ho mochini o behang
· Tlhahlobo ea boemo boemong ba APC offset
· Sistimi e sekaseka lintlha tsa tekanyo ea boemo ba karolo ea AOI, e lokisa boemo ba sebaka (X, Y, θ) , 'me ka hona e boloka ho nepahala ha sebaka.E lumellana le likaroloana tsa chip, likaroloana tse tlase tsa elektrode le likarolo tsa loto*2
* 1 : APC-FB (feedback) /FF (feedforward) : Mochini oa tlhahlobo oa 3D oa k'hamphani e 'ngoe o ka boela oa kopanngoa.(Ka kopo, botsa morekisi oa lehae bakeng sa lintlha.)*2 : APC-MFB2 (mounter feedback2) : Mefuta e sebetsang ea likarolo e fapana ho tloha ho morekisi oa AOI ho ea ho o mong.(Ka kopo, botsa moemeli oa hau oa thekiso ea lehae bakeng sa lintlha.)
Khetho ea Netefatso ea Karolo - Seteishene sa tšehetso sa ho seta kantle ho marang-rang
E thibela liphoso tsa ho seta nakong ea phetoho E fana ka keketseho ea katleho ea tlhahiso ka ts'ebetso e bonolo
* Li-scanner tse se nang mohala le lisebelisoa tse ling tse lokelang ho fanoa ke moreki
· E thibela ho se be teng ha karolo ka boomo E thibela ho se behoe hantle ka ho netefatsa lintlha tsa tlhahiso ka lintlha tsa barcode mabapi le likarolo tsa phetoho.
· Automatic setup data synching functionMochini ka boeona o etsa netefatso, o tlosa tlhoko ea ho khetha data ea ho seta e arohaneng.
· Interlock tshebetsoMathata leha e le efe kapa ho hloleha ho netefatsa ho tla emisa mochini.
· Mosebetsi oa navigationTsebetso ea ho tsamaea ho etsa hore ts'ebetso ea netefatso e utloisisehe habonolo.
Ka liteishene tsa ts'ehetso, ho ka khoneha ho lokisa likariki tse fepelang kantle ho marang-rang esita le ka ntle ho sebaka sa tlhahiso.
· Mefuta e 'meli ea liteishene tsa tšehetso lia fumaneha.
Bokhoni ba ho fetola - Khetho ea phetoho e iketsang
Ho tšehetsa phetoho (data ea tlhahiso le phetoho ea bophara ba terene) e ka fokotsa tahlehelo ea nako
* Mokhoa oa ho bala ID ea PCB ka mofuta oa PCB ID ea ho bala o ka khethoa har'a mefuta e 3 ea sekena sa kantle, kh'amera ea hlooho kapa foromo ea moralo.
Bokhoni ba ho fetola - Khetho ea ho seta sa phepelo ea phepelo
Ke sesebelisoa sa ts'ehetso ho tsamaisa mokhoa o sebetsang oa ho seta.Lisebelisoa tsa lisebelisoa ka nako e lekaneng ea ho etsa le ho qeta ts'ebetso ea ho seta ha ho hakanngoa nako e hlokahalang bakeng sa tlhahiso le ho fa opareitara litaelo tsa ho seta.Sena se tla bona le ho tsamaisa ts'ebetso ea ho seta nakong ea ho seta mohala oa tlhahiso.
Ntlafatso ea sekhahla sa ts'ebetso - Likarolo tse fanang ka khetho ea navigator
Sesebelisoa sa ts'ehetso ea phepelo ea karolo se tsamaisang lintho tse tlang pele ka nepo tsa phepelo ea likarolo.E nka nako e setseng ho fihlela karolo e fela le tsela e nepahetseng ea motsamao oa opareitara ho romela litaelo tsa phepelo ea likarolo ho opareitara ka 'ngoe.Sena se fihlella phepelo ea likarolo tse sebetsang hantle.
*PanaCIM e hlokeha ho ba le basebetsi ba ikarabellang bakeng sa ho fana ka lisebelisoa ho mela e mengata ea tlhahiso.
Ts'ebetso ea puisano ea tlhahisoleseling ea PCB
Tlhahisoleseding ea kananelo ea matšoao e entsoeng mochining oa pele oa NPM moleng o fetisetsoa mecheng ea NPM e tlase. E ka fokotsang nako ea potoloho ka ho sebelisa tlhaiso-leseling e fetisitsoeng.
Sistimi ea Tlhahiso ea Lintlha - NPM-DGS (Moetso oa No.NM-EJS9A)
Ena ke sephutheloana sa software se fanang ka taolo e kopaneng ea laebrari ea karolo le data ea PCB, hammoho le data ea tlhahiso e eketsang mela e ntseng e phahama ka li-algorithms tsa ts'ebetso e phahameng le ts'ebetso.
*1:Komporo e tlameha ho rekoa ka thoko.*2: NPM-DGS e na le mesebetsi e 'meli ea tsamaiso ea mokato le mola.
CAD import
E u lumella ho kenya data ea CAD le ho hlahloba polarity, joalo-joalo, skrineng.
Ntlafatso
E hlokomela tlhahiso e phahameng hape e u lumella ho theha lihlopha tse tloaelehileng.
Mohlophisi oa PPD
Ntlafatsa lintlha tsa tlhahiso ho PC nakong ea tlhahiso ho fokotsa tahlehelo ea nako.
Laebrari ea likarolo
E lumella taolo e kopaneng ea laeborari ea karolo ho kenyelletsa ho hlongoa, ho hlahloba le ho fana ka thepa.
Sistimi ea Tlhahiso ea data - Khamera e kantle ho Marang-rang (khetho)
Lintlha tsa likarolo li ka etsoa ntle le marang-rang le ha mochini o ntse o sebetsa.
Sebelisa khamera ea mohala ho etsa lintlha tsa likarolo.Maemo a ho khantša le lebelo la ho lemoha li ka netefatsoa esale pele, kahoo li kenya letsoho ntlafatsong ea tlhahiso le boleng.
 | Yuniti ea Khamera e kantle ho Marang-rang |
Sistimi ea Tlhahiso ea data - DGS Automation (khetho)
Mesebetsi e ikemetseng ea matsoho e fokotsa liphoso tsa ts'ebetso le nako ea tlhahiso ea data.
Ka ho sebelisana le sistimi ea bareki, mesebetsi e tloaelehileng ea ho theha data e ka fokotsoa, ka hona e thusa ho fokotsa haholo nako ea tlhahiso ea tlhahiso. mounting point (Virtual AOI).
Mohlala oa setšoantšo sa tsamaiso eohle
Mesebetsi e ikemetseng (e qotsitsoeng)
· CAD import
·Ho hlophisoa ha letšoao la Offset
· PCB e hohela
·Tokiso ea ho se lumellane ha ntlha e ntseng e phahama
·Theho ea mesebetsi
·Ho ntlafatsa
· Tlhahiso ea PPD
· Khoasolla
Sistimi ea Tlhahiso ea data - Ntlafatso ea ho seta (khetho)
Tlhahisong e kenyelletsang mefuta e mengata, meroalo ea mesebetsi ea ho seta e nahanoa le ho ntlafatsoa.
Bakeng sa PCB e fetang e le 'ngoe e arolelanang karolo e tloaelehileng ea ho beoa, ho ka hlokahala litlhophiso tse ngata ka lebaka la khaello ea li-sppy units.E le ho fokotsa mesebetsi e hlokahalang ea ho seta boemong bo joalo, khetho ena e arola li-PCB ka lihlopha tse tšoanang tsa ho beha likarolo, khetha tafole ( s) bakeng sa ho seta mme ka hona e iketsetsa tšebetso ea ho beha likarolo. E thusa ho ntlafatsa ts'ebetso ea ho seta le ho fokotsa nako ea ho itokisetsa tlhahiso bakeng sa ho etsa mefuta e fapaneng ea lihlahisoa ka bongata bo fokolang.
Mohlala
Ntlafatso ea boleng - Sebali sa tlhaiso-leseling ea boleng
Ena ke software e etselitsoeng ho ts'ehetsa kutloisiso ea lintlha tse fetohang le tlhahlobo ea lintlha tse nang le bofokoli ka ho bonts'a tlhaiso-leseling e amanang le boleng (mohlala, maemo a phepelo a sebelisitsoeng, boleng ba tlhokomeliso le lintlha tsa likarolo) ho PCB ka 'ngoe kapa sebaka sa ho beoa.Tabeng ea hlooho ea rona ea tlhahlobo e hlahisoang, libaka tse nang le bokooa li ka bontšoa ka ho kopana le boitsebiso bo amanang le boleng.
Fesetere ea pono ea litaba tsa boleng bo holimo
Mohlala oa ts'ebeliso ea sebali sa tlhaiso-leseling ea boleng
E hloaea sesebelisoa se sebelisetsoang ho kenya liboto tse nang le bokooa.'Me haeba, ho etsa mohlala, u na le mesalignments tse ngata ka mor'a ho splicing, mabaka a sekoli a ka nkoa e le ka lebaka la;
1.splicing liphoso (ho kheloha ha molumo ho senoloa ke ho lemoha boleng ba offset)
2.ho fetoha ha sebopeho sa motsoako (lotho e fosahetseng ea reel kapa barekisi)
Kahoo u ka nka khato e potlakileng ho khalemelo e fosahetseng.
Tlhaloso
| ID ea mohlala | NPM-D3 | |||||
| Hlooho e ka morao Hlooho e ka pele | Hlooho e bobebe ea 16-nozzle | 12-nozzle hlooho | 8-nozzle hlooho | 2-nozzle hlooho | Hlooho e abelang | Ha ho hlooho |
| Hlooho e bobebe ea 16-nozzle | NM-EJM6D | NM-EJM6D-MD | NM-EJM6D | |||
| 12-nozzle hlooho | ||||||
| 8-nozzle hlooho | ||||||
| 2-nozzle hlooho | ||||||
| Hlooho e abelang | NM-EJM6D-MD | NM-EJM6D-D | ||||
| Hlooho ea ho hlahloba | NM-EJM6D-MA | NM-EJM6D-A | ||||
| Ha ho hlooho | NM-EJM6D | NM-EJM6D-D | ||||
| PCB boholo*1(mm) | Mokhoa oa litsela tse peli | L 50 x W 50 ~ L 510 x W 300 |
| Mokhoa o le mong | L 50 x W 50 ~ L 510 x W 590 | |
| PCBexchangetime | Dual-lanemode | 0 s* *Ha ho 0s ha nako ea potoloho e le 3.6 s kapa ka tlase |
| Mokhoa o le mong | 3.6 s* *Ha u khetha li-conveyor tse khutšoane | |
| Mohloli oa motlakase | 3-mohato AC 200, 220, 380, 400, 420, 480 V 2.7 kVA | |
| Mohloli oa moea *2 | 0.5 MPa, 100 L /m (ANR) | |
| Boholo *2 (mm) | W 832 x D 2 652 *3 x H 1 444 *4 | |
| Mmisa | 1 680 kg (Ke bakeng sa 'mele oa mantlha feela: Sena se fapana ho latela khetho ea khetho.) | |
| Hlooho ya ho beha | Hlooho e bobebe ea 16-nozzle (Hlooho ka 'ngoe) | 12-nozzle hlooho (hlooho ka 'ngoe) | 8-nozzle hlooho (ka hlooho) | 2-nozzle hlooho (hlooho ka 'ngoe) | ||
| Mokhoa o phahameng oa tlhahiso [ON] | Mokhoa o phahameng oa tlhahiso [OFF] | |||||
| Max.lebelo | 42 000 cph(0.086 s/ chip) | 38 000 cph(0.095 s/ chip) | 34 500 cph(0.104 s/ chip) | 21 500 cph(0.167 s/ chip) | 5 500 cph (0.655 s/ chip)4 250 cph (0.847 s/ QFP) | |
| Ho nepahala ha sebaka (Cpk □1) | ± 40 µm/chip | ± 30 μm / chip(±25 μm / chip*5) | ± 30 μm / chip | ± 30 µm/chip ± 30 µm/QFP □ 12mm ho □ 32mm ± 50 □ 12mm Tlas'aµm/QFP | ± 30 µm/QFP | |
| Likarolo tsa likarolo (mm) | 0402 chip*6 ho L 6 x W 6 x T 3 | 03015*6*7/0402 chip*6 ho L 6 x W 6 x T 3 | 0402 chip * 6 ho L 12 x W 12 x T 6.5 | 0402 chip*6 ho L 32 x W 32 x T 12 | 0603 chip ho L 100 x W 90 x T 28 | |
| Componentsupply | Ho tlanya | Theipi: 4/8/12/16/24/32/44/56 mm | ||||
| Ho tlanya | Max.68 (tape ea 4, 8 mm, Reel e nyane) | |||||
| Thupa | Max.16 (Sephepelo sa thupa e le 'ngoe) | |||||
| Terei | Max.20 (ho fepa ka terei) | |||||
| Hlooho e abelang | Ho fana ka matheba | Tlisa kabo |
| Lebelo la ho aba | 0.16 s/dot (Boemo : XY=10 mm, Z=ka tlase ho 4 mm motsamao, Ha ho θ ho potoloha) | 4.25 s/karolo (Boemo: 30 mm x 30 mm hukung ya phepelo)*8 |
| Ho nepahala ha boemo ba sekhomaretsi(Cpk □1) | ± 75 μ m / letheba | ± 100 μ m /karolo |
| Likarolo tse sebetsang | 1608 chip ho SOP,PLCC,QFP, Connector, BGA, CSP | SOP,PLCC,QFP, Connector, BGA, CSP |
| Hlooho ea ho hlahloba | Hlooho ea tlhahlobo ea 2D (A) | Hlooho ea tlhahlobo ea 2D (B) | |
| Qeto | 18µm | 9µm | |
| Sheba boholo (mm) | 44.4 x 37.2 | 21.1 x 17.6 | |
| Inspectionb nako ea ho sebetsa | SolderInspection*9 | 0.35s/ Boholo ba pono | |
| Tlhahlobo ea Karolo*9 | 0.5s/ Boholo ba pono | ||
| Ntho ea ho hlahloba | SolderInspection *9 | Karolo ea chip: 100 μm x 150 μm kapa ho feta (0603 limilimithara kapa ho feta)Karolo ea sephuthelo : φ150 μm kapa ho feta | Karolo ea chip: 80 μm x 120 μm kapa ho feta (0402 limilimithara kapa ho feta)Karolo ea sephutheloana: φ120 μm kapa ho feta |
| Tlhahlobo ea Karolo *9 | Square chip (0603 mm kapa ho feta), SOP, QFP (sekontiri sa 0.4 mm kapa ho feta), CSP, BGA, Aluminium electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | Square chip (0402 mm kapa ho feta), SOP, QFP (sekontiri sa 0.3 mm kapa ho feta), CSP, BGA,Aluminium electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | |
| Lintho tsa ho hlahloba | SolderInspection *9 | Ho thothomela, ho fifala, ho se tsamaisane hantle, sebopeho se sa tloaelehang, borokho | |
| Tlhahlobo ea Karolo *9 | Ho haella, ho sisinyeha, ho phethola, polarity, tlhahlobo ea ntho e tsoang kantle ho naha *11 | ||
| Ho nepahala ha boemo ba tlhahlobo *12( Cpk □1) | ± 20 μm | ± 10 μm | |
| Che ea tlhahlobo | SolderInspection *9 | ||
| Tlhahlobo ea Karolo *9 | |||
| *1 : | Ka lebaka la phapang pakeng tsa litšupiso tsa phetisetso ea PCB, khokahano e tobileng le NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) li-specs tsa litsela tse peli li ke ke tsa thehoa. |
| *2 : | Feela bakeng sa 'mele o moholo |
| *3 : | Bophahamo ba D ho kenyeletsoa le sefepi sa terei : 2 683 mmDimension D ho kenyelletswa le kariki e fepang : 2 728 mm |
| *4 : | Ho sa kenyelelitsoe sebono, tora ea mats'oao le sekoaelo sa fan sa siling. |
| *5 : | ± 25 μm khetho ea ts'ehetso ea ho beha.(Tlas'a maemo a boletsoeng ke Panasonic) |
| *6 : | Chip ea 03015/0402 mm e hloka nozzle/feeder e itseng. |
| *7 : | Ts'ehetso ea ho beoa ha chip ea 03015 mm ke boikhethelo. |
| *8 : | Nako ea tekanyo ea bolelele ba PCB ea 0.5s e kenyelelitsoe. |
| *9 : | Hlooho e le 'ngoe e ke ke ea sebetsana le tlhahlobo ea solder le tlhahlobo ea likarolo ka nako e le' ngoe. |
| *10 : | Ka kopo sheba bukana ea litlhaloso bakeng sa lintlha. |
| *11 : | Ntho ea kantle ho naha e fumaneha ho likarolo tsa chip.(ntle le 03015 mm chip) |
| *12 : | Ena ke boemo bo nepahetseng ba tlhahlobo ea solder e lekantsoeng ke referense ea rona re sebelisa khalase ea PCB bakeng sa ho lekanya sefofane.E ka 'na ea angoa ke phetoho ea tšohanyetso ea mocheso o potolohileng. |
* Nako ea masene ea ho beha, nako ea tlhahlobo le boleng ba ho nepahala li ka fapana hanyane ho latela maemo.
* Ka kopo sheba bukana ea litlhaloso bakeng sa lintlha.
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